D-Sub High Density Solder Connector




 
Description :
The new High Density D-Subminiature range is part of FCI's I/O-Connections portfolio which provides customers access to a wide range of industry standard and application specific I/O interconnect solutions. FCI's I/O connector solutions complete your board and system designs by providing high-density and high-speed interfaces to enable interconnect technologies for networking, storage and memory and complementary products for power distribution. Our range of standardized I/O solutions enables full compliance to industry standards, such as Ethernet, SFF, Infiniband, USB, PCMCIA or HDMI. FCI also has the capability to provide customized I/O solutions optimized to address application specific requirements.
   
Materials & Finishes :
Insulator PBT Glass filled Nylon-6T UL 94V-0
Brass; (Male)
Brass or Phosphor bronze (female)
Shell   Steel
Plating Contact
  1.Gold Flash (Complete)
2.Selective gold over nickel plated (contact area) Tin/Lead over nickel plated (Tail area)
Shell Tin or Zinc over Copper Plated
   
Electrical Characteristics :
Rating Current 3 Amp
Contact Resistance < 15 Milli OHM / < 25 Milli OHM
Insulation Resistance > 3000 MegOHM at 500 V
Dielectric Voltage 1000V at 1 min.
500V at 1 minute (108D Series)
Operating Temparature -55° c to +105° c
   
Specification Table :
Position
A B C D E F
15F
16.30 25.00 30.80 2.29 1.14 19.2
26F 24.60 33.30 39.02 2.29 1.14 27.7
44F 38.30 47.10 53.10 2.29 1.14 41.1
62F 54.80 63.50 69.40 2.41 1.20 57.3

 

Position
A B C D E F
15M
16.92 25.00 30.08 2.29 1.14 19.2
26M 25.25 33.30 39.02 2.29 1.14 27.7
44M 38.96 47.10 53.10 2.29 1.14 41.1
62M 55.42 63.50 69.40 2.41 1.20 57.3

 

   
 
 
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